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tde
tBG2 - FO splice module 6x LC duplex MM 3U/7HP with pigtails 50/125µ OM4
Article ID
TBG2-M06-06LCD50-4S
The tBG II – FO splice module 3U/7HP is intended for the installation in tBG II - subracks (for 12 x modules).
Features:
- Available for all standard FO connectors: E2000, FC/PC, LC, SC and ST
- Integrated loose tube strain relief
- Module mounting with screws
| Pre-mounted | 6 LC duplex adapters 12 LC Fiber pigtails 50/125µ OM4 12 Crimp Splice protectors 1 Splice cassettes 1 Splice holder 1 Splice cover |
| Alternative pre-mounted |
TBG2-M06-xxLCD50-4S |
| xx | (01 - 06) quantity of adapters |
tBG2 - Front panel with module loading 3U/7HP 6 x LC Duplex
| Type | Front panel for 6 x LC Duplex |
| Color | Anodized E6 EV1 |
| Inscription | 1 - 12 Screen printing by label strips |
| Mateial | Alu- AlMG3 G22 |
| Dimensions | 3U/7HP |
| Type | Module slot for rack 3U/84HP |
| Dimensions | app. 250 x 100 mm |
LC Duplex Adapter Zirconia Straight Split with Flange, magenta
| Type | LC Duplex |
| Application | Multimode OM4 |
| Design | One-Piece with Flange |
| Connector style | SC Simplex |
| Color | Magenta |
| Material | Plastic |
| Sleeve | Zirkonia Staight Split |
| Shutter | - |
| Manufacturer | tde |
FO LC Simplex Connector tde class C for 50/125µ OM4 fiber
| Connector Type | LC Unibody Simplex |
| Housing | Plastic, Magenta |
| Ferrule | Zirkonia Staight Split, Spring-loaded Axially |
| Ferrule Hole | 126 µ |
| Mating Cycles | 1.000 |
| Operating Temperature | -40°C up to +75°C |
| Strain Relief to | 100 N |
| Manufacturer | tde |
| Fiber | Type | Wavelength | Insertion loss typ. | Insertion loss max. | Return loss min. |
|---|---|---|---|---|---|
| 50/125µ OM4 | LC | 850 nm | ≤ 0.25 dB | 0.45 dB | 30 dB |
IL at 97% measured according to IEC 61300-3-4 under laboratory conditions.
FO Cables
| Tight Buffer | Low smoke (IEC 61034 and EN 50268) and free of halogens (LS0H) |
| Non corrosive after IEC 60754-2 and EN 50267 | |
| Flame resistent after IEC 60332-3C and EN 50266-2-4 | |
| Completly dry design | |
| Free from metal, no grounding problems and potential differences | |
| Tight Buffer for simple and direct connector mounting |
| Fiber Count | 1 (Tight Buffer) |
| Core-Ø | 0.9 mm |
| Coreweight | 1 kg/km |
| Min. Bending radius - Installation | 30 mm |
| Min. Bending radius - Operation | 30 mm |
| Removal | 1500 mm |
|
Fire load |
0.15 MJ/m |
|
Temperature range - Installation |
-5 to +50°C |
|
Temperature range - Operation |
-20 to +60°C |
|
Temperature range - Transport / Lagerung |
-25 to +70°C |
Corning FO ClearCurve® 50/125µ OM4 multimode fiber
| Type | Corning ClearCurve® 50/125µ OM4 multimode fiber |
| Optimized Data Rate over Distance | 40/100 Gb over 170 m* 10 Gb/s over 550 m 1 Gb/s over 1100 m |
| Standard Compliance | ISO/IEC 11801: type OM4 fiber** IEC 60793-2-10: type A1a.3 fiber** TIA/EIA: 492AAAD ITU: ITU G651.1 |
| * | Distances specified in the 40G/100G per IEEE 802.3ba standard are 150m on OM4 and 100m on OM3; Corning fibers are manufactured to tighter dispersion specifications and thereby support the extended distances shown in the table (assuming cable attenuation ≤3.0 dB/km and same 1.0 dB of connector loss for OM3 that the standard requires for OM4) |
| ** | Assumes IEC draft standard is harmonized with 492AAAD which was approved by TIA |
| Bandwidth | High Performance EMB* (MHz.km): 4700 at 850 nm only Legacy Performance EMB** (MHz.km): 3500 at 850 nm / 500 at 1300 nm |
| Attenuation | At 850 nm max. ≤ 2.3 dB/km At 1300 nm max. ≤ 0.6 dB/km |
| Macrobend Loss | Mandrel Radius (mm): 37.2 / 15 / 7.5 Number of Turns: 100 / 2 / 2 Induced Attenuation (dB) at 850 nm: ≤ 0.05 / ≤ 0.1 / 0.2 Induced Attenuation (dB) at 1300 nm: ≤ 0.15 / ≤ 0.3 / ≤ 0.5 |
| Numerical Aperture | 0.200 ± 0.015 |
| * | Ensured via miniEMBc, per TIA/EIA 455-220A and IEC 60793-1-49, for high performance laser-based systems (up to 10Gb/s) |
| ** | OFL BW, per TIA/EIA 455-204 and IEC 60793-1-41, for legacy and LED-based systems (typically up to 100 Mb/s) |
| Core Diameter | 50.0 ± 2.5 µm |
| Cladding Diameter | 125.0 ± 1.0 µm |
| Core-Clad Concentricity | ≤ 1.5 µm |
| Cladding Non-Circularity | ≤ 1.0% |
| Core Non-Circularity | ≤ 5.0% |
| Coating Diameter | 242 ± 5 µm |
| Coating-Cladding Concentricity | < 12 µm |
| Enviromental Test | Test Condition | Induced Attenuation 850 nm & 1300 nm (dB/km) |
|---|---|---|
| Temperature Dependence | -60°C to +85°C | ≤ 0.10 |
| Temperature Humidity Cycling | -10°C to +85°C and 4% to 98% RH | ≤ 0.10 |
| Water Immersion | 23°C ± 2°C | ≤ 0.20 |
| Heat Aging | 85°C ± 2°C | ≤ 0.20 |
| Damp Heat | 85°C at 85% RH | ≤ 0.20 |
| Operating Temperature Range | -60°C to +85°C |
| Proof Test | The entire fiber length is subjected to a tensile stress ≥ 100 kpsi (0.7 GN/m²). |
| Length | Fiber lengths available up to 17.6 km/spool. |
| Refractive Index Difference | 1% |
| Effective Group Index of Refraction | 850 nm: 1.480 1300 nm: 1.479 |
| Fatigue Resistance Parameter (nd) | 20 |
| Coating Strip Force | Dry: 0.6 lbs (2.7N) Wet: 14 days in 23°C water soak: 0.6 lbs (2.7N) |
| Cromatic Dispersion | Zero Dispersion Wavelength (λ0): 1295 nm ≤ λ0 ≤ 1315 nm Zero Dispersion Slope (S0): ≤ 0.101 ps/(nm²*km) |
| Delivery time | 5-10 working days |
|---|---|
| Manufacturer | tde |
| Systems | tBG II - tde Subrack |
| Category | FO splice module standard |
| Mediaobjects | |
| Connector type (side 1) | LC Duplex, LC Simplex |
| Fiber type | 50/125 µm OM4 |
| Type | LC |
| Adapter color | Magenta |
| Patch panel type | tBGII – FO Module for tBGII sub rack |
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